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Remote plasma-enhanced atomic layer deposition of metallic TiN films with low work function and high uniformity
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 36, 041501 (2018)
Date:
2018-05-02
Author Information
| Name | Institution |
|---|---|
| Yafeng Zhu | Chinese Academy of Sciences |
| Fangsen Li | Chinese Academy of Sciences |
| Rong Huang | Chinese Academy of Sciences |
| Tong Liu | Chinese Academy of Sciences |
| Yanfei Zhao | Chinese Academy of Sciences |
| Yang Shen | Chinese Academy of Sciences |
| Jian Zhang | Chinese Academy of Sciences |
| An Dingsun | Chinese Academy of Sciences |
| Yun Guo | Shanghai University |
Films
Plasma TiN
Film/Plasma Properties
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry
Characteristic: Work Function
Analysis: UPS, Ultraviolet Photoemission Spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Substrates
| Si(100) |
| GaN |
Notes
| 1551 |