Remote plasma-enhanced atomic layer deposition of metallic TiN films with low work function and high uniformity

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 36, 041501 (2018)
Date:
2018-05-02

Author Information

Name Institution
Yafeng ZhuChinese Academy of Sciences
Fangsen LiChinese Academy of Sciences
Rong HuangChinese Academy of Sciences
Tong LiuChinese Academy of Sciences
Yanfei ZhaoChinese Academy of Sciences
Yang ShenChinese Academy of Sciences
Jian ZhangChinese Academy of Sciences
An DingsunChinese Academy of Sciences
Yun GuoShanghai University

Films

Plasma TiN


Film/Plasma Properties

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

Characteristic: Work Function
Analysis: UPS, Ultraviolet Photoemission Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Substrates

Si(100)
GaN

Keywords

Notes

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