Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.



Plasma-enhanced ALD system for SRF cavity

Type:
Conference Proceedings
Info:
18th International Conference on RF Superconductivity
Date:
2017-07-17

Author Information

Name Institution
S. KatoHigh Energy Accelerator Research Organization (KEK)
H. HayanoHigh Energy Accelerator Research Organization (KEK)

Films

Plasma NbN


Film/Plasma Properties

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Substrates

Silicon

Notes

1116