Publication Information

Title:
Characteristics of WNxCy films deposited using remote plasma atomic layer deposition with (MeCp)W(CO)2(NO) for Cu diffusion barrier
Type:
Journal
Info:
J. Vac. Sci. Technol. A 33(5), Sep/Oct 2015
Date:
2015-06-15

Author Information

Name Institution
Hyunjung KimHanyang University
Jingyu ParkHanyang University
Heeyoung JeonHanyang University
Woochool JangHanyang University
Hyeongtag JeonHanyang University
Junhan YuhPOSCO

Films

Plasma WCN


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Diffusion Barrier Properties
Analysis: XRD, X-Ray Diffraction

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

SiO2

Keywords

Diffusion Barrier
Interconnect

Notes

PEALD WNC for Cu interconnect diffusion barrier.
314