Search 1556 plasma ALD publications by:
Search 1556 plasma ALD publications by:
Reliability testing of high aspect ratio through silicon vias fabricated with atomic layer deposition barrier, seed layer and direct plating and material properties characterization of electrografted insulator, barrier and seed layer for 3-D integration
Type:
Conference Proceedings
Info:
2010 IEEE International 3D Systems Integration Conference (3DIC)
Date:
2010-11-16
Author Information
Name | Institution |
---|---|
J. D. Reed | RTI International |
S. Goodwin | RTI International |
C. Gregory | RTI International |
D. Temple | RTI International |
Films
Film/Plasma Properties
Characteristic: Morphology, Roughness, Topography
Analysis: -
Characteristic: Resistivity, Sheet Resistance
Analysis: -
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Substrates
SiO2 |
Keywords
Plasma vs Thermal Comparison |
Notes
731 |
Popular Precursors
Top Authors
Erwin (W.M.M.) Kessels |
Hyeongtag Jeon |
Hyungjun Kim |
Mauritius C. M. (Richard) van de Sanden |
Christophe Detavernier |