Publication Information

Title: Low-Temperature Conformal Atomic Layer Deposition of SiNx Films Using Si2Cl6 and NH3 Plasma

Type: Journal

Info: ACS Appl. Mater. Interfaces, 2015, 7 (20), pp 10806-10813

Date: 2015-04-30

DOI: http://dx.doi.org/10.1021/acsami.5b01531

Author Information

Name

Institution

Colorado School of Mines

Lam Research Corporation

Colorado School of Mines

Films

Plasma SiNx using Custom

Deposition Temperature Range = 350-450C

13465-77-5

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Bonding States

ATR-FTIR

Nicolet 6700

Images

SEM, Scanning Electron Microscopy

JEOL 2010F

Thickness

Ellipsometry

-

Chemical Composition, Impurities

HFS, Hydrogen Forward Scattering

-

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

-

Substrates

SiO2

Keywords

Notes

355



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