Publication Information

Title:
Atomic layer deposition growth of a novel mixed-phase barrier for seedless copper electroplating applications
Type:
Journal
Info:
J. Vac. Sci. Technol. A 27(3), May/Jun 2009
Date:
2009-04-28

Author Information

Name Institution
Sumit KumarState University of New York at Albany
Daniel V. GreenslitState University of New York at Albany
Tonmoy ChakrabortyState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Barrier Characteristics
Analysis: TVS, Triangle Voltage Sweep

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

SiO2

Keywords

Notes

Praxair Ru precursor.
118