Highly-Conformal TiN Thin Films Grown by Thermal and Plasma-Enhanced Atomic Layer Deposition
Type:
Journal
Info:
ECS Journal of Solid State Science and Technology, 3 (7) P253-P258 (2014)
Date:
2014-05-14
Author Information
| Name | Institution |
|---|---|
| Loïc Assaud | Aix-Marseille Université |
| Kristina Pitzschel | Aix-Marseille Université |
| Margrit Hanbücken | Aix-Marseille Université |
| Lionel Santinacci | Aix-Marseille Université |
Films
Thermal TiN
Plasma TiN
Film/Plasma Properties
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Substrates
| AAO, Anodic Aluminum Oxide |
| Si(100) |
Notes
| Ultratech Fiji thermal and PEALD TiN on high aspect ratio AAO substrates. |
| 303 |