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Publication Information

Title: Characteristics of Tungsten Carbide Films Prepared by Plasma-Assisted ALD Using Bis(tert-butylimido)bis(dimethylamido)tungsten

Type: Journal

Info: Journal of The Electrochemical Society, 150 (10) C740-C744 (2003)

Date: 2003-09-02

DOI: http://dx.doi.org/10.1149/1.1610000

Author Information

Name

Institution

Chonnam National University

Chonnam National University

Chonnam National University

Chonnam National University

Chonnam National University

Harvard University

Harvard University

Films

Plasma WC using Custom

Deposition Temperature Range N/A

406462-43-9

7727-37-9

1333-74-0

Plasma WC using Custom

Deposition Temperature Range N/A

406462-43-9

7727-37-9

Plasma WC using Custom

Deposition Temperature Range N/A

406462-43-9

1333-74-0

Thermal WC using Custom

Deposition Temperature Range N/A

406462-43-9

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Resistivity, Sheet Resistance

Four-point Probe

Unknown

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Unknown

Conformality, Step Coverage

SEM, Scanning Electron Microscopy

Unknown

Oxidation Resistance

Four-point Probe

Unknown

Chemical Composition, Impurities

AES, Auger Electron Spectroscopy

Unknown

Thickness

XRR, X-Ray Reflectivity

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Unknown

Substrates

SiO2

Keywords

Diffusion Barrier

Notes

52

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I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. If you know of publications I have missed or a database entry is wrong, send me an email at: marksowa@plasma-ald.com

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