Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:

  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.



Plasma nitridation of atomic layer deposition (ALD) Al2O3 by NH3 in plasma-enhanced chemical vapor deposition (PECVD) for silicon solar cell

Type:
Journal
Info:
Surface & Coatings Technology 307, Part B (2016) 1096 - 1099
Date:
2016-05-19

Author Information

Name Institution
Young Joon ChoChungnam National University
Hamchorom ChaChungnam National University
Hyo Sik ChangChungnam National University

Films



Film/Plasma Properties

Characteristic: Lifetime
Analysis: QSSPC, Quasi-Steady-State PhotoConductance Decay

Characteristic: Open Circuit Voltage
Analysis: QSSPC, Quasi-Steady-State PhotoConductance Decay

Characteristic: Compositional Depth Profiling
Analysis: SIMS, Secondary Ion Mass Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Photoluminescence
Analysis: PL, PhotoLuminescence

Substrates

Silicon

Notes

824