Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma

Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 45, No. 6, pp. 1639-1643
Date:
2004-08-03

Author Information

Name Institution
Ju Youn KimHanyang University
Do Youl KimHanyang University
Hee Ok ParkHanyang University
Hyeongtag JeonHanyang University

Films


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Substrates

SiO2

Notes

1241