
Remote Plasma-Enhanced Atomic-Layer Deposition of TiN by Using TDMAT with a NH3 Plasma
Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 45, No. 6, pp. 1639-1643
Date:
2004-08-03
Author Information
Name | Institution |
---|---|
Ju Youn Kim | Hanyang University |
Do Youl Kim | Hanyang University |
Hee Ok Park | Hanyang University |
Hyeongtag Jeon | Hanyang University |
Films
Plasma TiN
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Substrates
SiO2 |
Notes
1241 |