Passivation of InGaAs interface states by thin AlN interface layers for metal-insulator-semiconductor applications
Type:
Journal
Info:
Journal of Vacuum Science & Technology B 35, 011205 (2017)
Date:
2016-12-12
Author Information
Name | Institution |
---|---|
Igor Krylov | Technion-Israel Institute of Technology |
Boaz Pokroy | Technion-Israel Institute of Technology |
Dan Ritter | Technion-Israel Institute of Technology |
Moshe Eizenberg | Technion-Israel Institute of Technology |
Films
Thermal Al2O3
Plasma AlN
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Interface Trap Density
Analysis: C-V, Capacitance-Voltage Measurements
Substrates
InGaAs |
Notes
885 |