Publication Information

Title:
Development of Manufacturable Solutions for the Direct Plating of Copper on Robust ALD-Grown Barriers
Type:
Journal
Info:
ECS Transactions, 6 (8) 77-88 (2007)
Date:
2007-05-09

Author Information

Name Institution
Sumit KumarState University of New York at Albany
Daniel V. GreenslitState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films

Plasma Ru

Hardware used: Unknown


CAS#: 7664-41-7

Plasma Ru

Hardware used: Unknown


CAS#: 7664-41-7

Plasma TaNx


Film/Plasma Properties

Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Diffusion Barrier Properties
Analysis: Custom

Substrates

SiO2
TaN

Keywords

Diffusion Barrier
Seed Layer

Notes

1319