Electrical and structural properties of conductive nitride films grown by plasma enhanced atomic layer deposition with significant ion bombardment effect
Type:
Journal
Info:
Journal of Applied Physics 128, 065301 (2020)
Date:
2020-07-24
Author Information
Name | Institution |
---|---|
Igor Krylov | Tower Semiconductor Ltd. |
Valentina Korchnoy | Technion-Israel Institute of Technology |
Xianbin Xu | Technion-Israel Institute of Technology |
Kamira Weinfeld | Technion-Israel Institute of Technology |
Eilam Yalon | Technion-Israel Institute of Technology |
Dan Ritter | Technion-Israel Institute of Technology |
Moshe Eizenberg | Technion-Israel Institute of Technology |
Films
Plasma TiN
Plasma ZrN
Plasma HfNx
Plasma HfNx
Plasma TaNx
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: Custom
Characteristic: TCR, Temperature Coefficient of Resistivity
Analysis: Custom
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Substrates
SiO2 |
Notes
1594 |