Title: Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers
Type: Journal
Info: Journal of Vacuum Science & Technology B 29, 030605 (2011)
Date: 2011-04-11
DOI: http://dx.doi.org/10.1116/1.3585664
Name
Institution
State University of New York at Albany
State University of New York at Albany
State University of New York at Albany
169896-41-7
Characteristic
Analysis
Diagnostic
Chemical Composition, Impurities
XPS, X-ray Photoelectron Spectroscopy
Thermo VG-Scientific theta probe
Morphology, Roughness, Topography
SEM, Scanning Electron Microscopy
LEO 1550
Resistivity, Sheet Resistance
Four-point Probe
Signatone SYS-301 resistivity probing system
Images
TEM, Transmission Electron Microscope
FEI Technai F20
SiO2
Interconnect
690
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