Nucleation and growth characteristics of electroplated Cu on plasma enhanced atomic layer deposition-grown RuTaN direct plate barriers

Type:
Journal
Info:
Journal of Vacuum Science & Technology B 29, 030605 (2011)
Date:
2011-04-11

Author Information

Name Institution
Tonmoy ChakrabortyState University of New York at Albany
Daniel V. GreenslitState University of New York at Albany
Eric T. EisenbraunState University of New York at Albany

Films


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Substrates

SiO2

Notes

690