Publication Information

Title: The Properties of Cu Thin Films on Ru Depending on the ALD Temperature

Type: Journal

Info: Journal of Nanoscience and Nanotechnology, Volume 15, Number 2, pp. 1601-1604

Date: 2015-02-01

DOI: http://dx.doi.org/doi:10.1166/jnn.2015.9286

Author Information

Name

Institution

Sungkyunkwan University

Sungkyunkwan University

Sungkyunkwan University

Sungkyunkwan University

Films

Plasma TaNx using Unknown

Deposition Temperature Range N/A

169896-41-7

1333-74-0

Plasma Ru using Unknown

Deposition Temperature Range N/A

0-0-0

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

SiO2

TaN

Keywords

Diffusion Barrier

Interconnect

Notes

543



Shortcuts



© 2014-2018 plasma-ald.com