Publication Information

Title:
The Properties of Cu Thin Films on Ru Depending on the ALD Temperature
Type:
Journal
Info:
Journal of Nanoscience and Nanotechnology, Volume 15, Number 2, pp. 1601-1604
Date:
2015-02-01

Author Information

Name Institution
Hyeong-Chul YoonSungkyunkwan University
Jin-Ha ShinSungkyunkwan University
Hwa-Sun ParkSungkyunkwan University
Su-Jeong SuhSungkyunkwan University

Films


Plasma Ru


Film/Plasma Properties

Substrates

SiO2
TaN

Keywords

Diffusion Barrier
Interconnect

Notes

543