Publication Information

Title: The Properties of Cu Thin Films on Ru Depending on the ALD Temperature

Type: Journal

Info: Journal of Nanoscience and Nanotechnology, Volume 15, Number 2, pp. 1601-1604

Date: 2015-02-01

DOI: http://dx.doi.org/doi:10.1166/jnn.2015.9286

Author Information

Name

Institution

Hyeong-Chul Yoon

Sungkyunkwan University

Jin-Ha Shin

Sungkyunkwan University

Hwa-Sun Park

Sungkyunkwan University

Su-Jeong Suh

Sungkyunkwan University

Films

Plasma TaNx using Unknown

Deposition Temperature Range N/A

TBTDET, Tert-Butylimido Tris(DiEthylamino) Tantalum, Ta[N(C2H5)2]3[=NC(CH3)3]

169896-41-7

Where to buy precursor

H2, Hydrogen

1333-74-0

Plasma Ru using Unknown

Deposition Temperature Range N/A

(2,4-dimethylpentadienyl) (ethylcyclopentadienyl) ruthenium [Ru(DMPD)(EtCp)]

0-0-0

NH3, Ammonia

7664-41-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

SiO2

TaN

Keywords

Diffusion Barrier

Interconnect

Notes

543


Mark Sowa

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