Publication Information

Title: The physical properties of cubic plasma-enhanced atomic layer deposition TaN films

Type: Journal

Info: Journal of Applied Physics 95, 5848-5855 (2004)

Date: 2004-02-25

DOI: http://dx.doi.org/10.1063/1.1704863

Author Information

Name

Institution

IBM

IBM

IBM

IBM

IBM

IBM

Films

Plasma TaNx using Custom ICP

Deposition Temperature = 300C

7721-01-9

1333-74-0

7727-37-9

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

-

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

-

Microstructure

TEM, Transmission Electron Microscope

JEOL JEM 4000EX

Chemical Composition, Impurities

MEIS, Medium Energy Ion Scattering

-

Thermal Stability

MEIS, Medium Energy Ion Scattering

-

Diffusion Barrier Properties

XRD, X-Ray Diffraction

-

Diffusion Barrier Properties

Optical Scattering

-

Diffusion Barrier Properties

Four-point Probe

-

Substrates

Si(001)

SiO2

Keywords

Diffusion Barrier

Notes

1242



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