Publication Information

Title:
The physical properties of cubic plasma-enhanced atomic layer deposition TaN films
Type:
Journal
Info:
Journal of Applied Physics 95, 5848-5855 (2004)
Date:
2004-02-25

Author Information

Name Institution
Hyungjun KimIBM
C. LavoieIBM
Matthew CopelIBM
Vijay NarayananIBM
Dong-Jin ParkIBM
S. M. RossnagelIBM

Films


Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Chemical Composition, Impurities
Analysis: MEIS, Medium Energy Ion Scattering

Characteristic: Thermal Stability
Analysis: MEIS, Medium Energy Ion Scattering

Characteristic: Diffusion Barrier Properties
Analysis: XRD, X-Ray Diffraction

Characteristic: Diffusion Barrier Properties
Analysis: Optical Scattering

Characteristic: Diffusion Barrier Properties
Analysis: Four-point Probe

Substrates

Si(001)
SiO2

Keywords

Diffusion Barrier

Notes

1242