Publication Information

Title: The physical properties of cubic plasma-enhanced atomic layer deposition TaN films

Type: Journal

Info: Journal of Applied Physics 95, 5848-5855 (2004)

Date: 2004-02-25

DOI: http://dx.doi.org/10.1063/1.1704863

Author Information

Name

Institution

IBM

IBM

IBM

IBM

IBM

IBM

Films

Plasma TaNx using Custom ICP

Deposition Temperature = 300C

7721-01-9

1333-74-0

7727-37-9

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Chemical Composition, Impurities

RBS, Rutherford Backscattering Spectrometry

Unknown

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Unknown

Microstructure

TEM, Transmission Electron Microscope

JEOL JEM 4000EX

Chemical Composition, Impurities

MEIS, Medium Energy Ion Scattering

Unknown

Thermal Stability

MEIS, Medium Energy Ion Scattering

Unknown

Diffusion Barrier Properties

XRD, X-Ray Diffraction

Unknown

Diffusion Barrier Properties

Optical Scattering

Unknown

Diffusion Barrier Properties

Four-point Probe

Unknown

Substrates

Si(001)

SiO2

Keywords

Diffusion Barrier

Notes

1242



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