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Plasma Enhanced Atomic Layer Deposition of Ruthenium Films Using Ru(EtCp)2 Precursor

Type:
Journal
Info:
Coatings 2021, 11, 117
Date:
2021-01-15

Author Information

Name Institution
Alexander E. RogozhinRussian Academy of Sciences
Andrey V. MiakonkikhRussian Academy of Sciences
Elizaveta SmirnovaRussian Academy of Sciences
Andrey LomovRussian Academy of Sciences
Sergey SimakinRussian Academy of Sciences
Konstantin V. RudenkoRussian Academy of Sciences

Films

Plasma Ru


Plasma RuO2


Plasma TaNx


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Stress
Analysis: Interferometry

Substrates

TaN
Si(100)
SiO2

Notes

1723