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Publication Information

Title: Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum

Type: Journal

Info: Journal of The Electrochemical Society, 157 (6) H652-H656 (2010)

Date: 2009-12-09

DOI: http://dx.doi.org/10.1149/1.3377003

Author Information

Name

Institution

Pohang University of Science and Technology (POSTECH)

Pohang University of Science and Technology (POSTECH)

Pohang University of Science and Technology (POSTECH)

Films

Deposition Temperature Range = 100-400C

169896-41-7

1333-74-0

Deposition Temperature Range = 100-400C

169896-41-7

1333-74-0

Deposition Temperature Range = 100-400C

169896-41-7

1333-74-0

Deposition Temperature Range = 100-400C

169896-41-7

1333-74-0

Deposition Temperature Range = 100-400C

169896-41-7

1333-74-0

Deposition Temperature Range = 100-400C

169896-41-7

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Deposition Kinetics, Reaction Mechanism

FTIR, Fourier Transform InfraRed spectroscopy

Nicolet Magna-IR 560

Gas Phase Species

FTIR, Fourier Transform InfraRed spectroscopy

Midac FTIR

Resistivity, Sheet Resistance

Four-point Probe

Unknown

Thickness

SEM, Scanning Electron Microscopy

JEOL JSM-840A

Thickness

XRR, X-Ray Reflectivity

Unknown

Density

XRR, X-Ray Reflectivity

Unknown

Substrates

SiO2

Keywords

Reaction Mechanism

Notes

721

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I am sure there are papers I have not found. I am sure there is an occasional typo or omission in the database entries. If you know of publications I have missed or a database entry is wrong, send me an email at: marksowa@plasma-ald.com

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