Chemical Reaction Mechanism in the Atomic Layer Deposition of TaCxNy Films Using tert-Butylimidotris(diethylamido)tantalum
Type:
Journal
Info:
Journal of The Electrochemical Society, 157 (6) H652-H656 (2010)
Date:
2009-12-09
Author Information
Name | Institution |
---|---|
Suk-Hoon Kim | Pohang University of Science and Technology (POSTECH) |
Moon-Kyun Song | Pohang University of Science and Technology (POSTECH) |
Shi-Woo Rhee | Pohang University of Science and Technology (POSTECH) |
Films
Thermal TaCN
Plasma TaCN
Thermal TaNx
Plasma TaNx
Thermal TaCx
Plasma TaCx
Film/Plasma Properties
Characteristic: Deposition Kinetics, Reaction Mechanism
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Characteristic: Gas Phase Species
Analysis: FTIR, Fourier Transform InfraRed spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Substrates
SiO2 |
Notes
721 |