Copper-ALD Seed Layer as an Enabler for Device Scaling
Type:
Conference Proceedings
Info:
ECS Transactions, 41 (2) 33-39 (2011)
Date:
2011-08-01
Author Information
| Name | Institution |
|---|---|
| Jiajun Mao | State University of New York at Albany |
| Eric T. Eisenbraun | State University of New York at Albany |
| Vincent Omarjee | Air Liquide |
| Andrey Korolev | Air Liquide |
| Christian Dussarrat | Air Liquide |
Films
Plasma Cu
Film/Plasma Properties
Characteristic: Precursor Characterization
Analysis: TGA, Thermo Gravimetric Analysis
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Adhesion
Analysis: Custom
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Substrates
| SiO2 |
| Ta |
| TaN |
| Ru |
Notes
| 682 |