Abacus, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

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1Copper-ALD Seed Layer as an Enabler for Device Scaling
2Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
3PEALD of Copper using New Precursors for Next Generation of Interconnections
4Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD