Your search for publications using this chemistry returned 3 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.
|1||Copper-ALD Seed Layer as an Enabler for Device Scaling|
|2||PEALD of Copper using New Precursors for Next Generation of Interconnections|
|3||Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD|
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