Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Abacus, CAS# 0-0-0

Plasma Enhanced Atomic Layer Deposition Film Publications

Your search for publications using this chemistry returned 4 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1PEALD of Copper using New Precursors for Next Generation of Interconnections
2Copper-ALD Seed Layer as an Enabler for Device Scaling
3Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD
4Ultra-Low Temperature Deposition of Copper Seed Layers by PEALD