Island Coalescence during Film Growth: An Underestimated Limitation of Cu ALD

Type:
Journal
Info:
Adv. Mater. Interfaces 2017, 4, 1700274
Date:
2017-05-02

Author Information

Name Institution
Dirk J. HagenAalto University
James ConnollyApplied Materials
Ian M. PoveyTyndall National Institute, University College Cork
S. RushworthEpiValence Ltd
Martin E. PembleTyndall National Institute, University College Cork

Films


Plasma Cu


Film/Plasma Properties

Characteristic: Microstructure
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Substrates

Silicon
TaN
CDO, Carbon Doped Oxide
Al2O3
Ru
Pd

Notes

1641