Non-destructive acoustic metrology and void detection in 3x50μm TSV
Type:
Conference Proceedings
Info:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Date:
2016-05-16
Author Information
| Name | Institution |
|---|---|
| R. Mair | Rudolph Technologies |
| M. Kotelyanskii | Rudolph Technologies |
| M. Mehendale | Rudolph Technologies |
| X. Ru | Rudolph Technologies |
| P. Mukundhan | Rudolph Technologies |
| T. Kryman | Rudolph Technologies |
| M. Liebens | IMEC |
| S. Van Huylenbroeck | IMEC |
| L. Haensel | IMEC |
| A. Miller | IMEC |
| E. Beyne | IMEC |
| T. Murray | University of Colorado, Boulder |
Films
Film/Plasma Properties
Substrates
Notes
| SiO2 is a guess at the "highly conformal Plasma Enhanced Atomic Layer Deposition (PEALD) oxide liner." |
| 953 |