Publication Information

Title:
Non-destructive acoustic metrology and void detection in 3x50μm TSV
Type:
Conference Proceedings
Info:
2016 27th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)
Date:
2016-05-16

Author Information

Name Institution
R. MairRudolph Technologies
M. KotelyanskiiRudolph Technologies
M. MehendaleRudolph Technologies
X. RuRudolph Technologies
P. MukundhanRudolph Technologies
T. KrymanRudolph Technologies
M. LiebensIMEC
S. Van HuylenbroeckIMEC
L. HaenselIMEC
A. MillerIMEC
E. BeyneIMEC
T. MurrayUniversity of Colorado, Boulder

Films

Plasma SiO2

Hardware used: Unknown


Thermal TiN

Hardware used: Unknown


Thermal Ru

Hardware used: Unknown


Film/Plasma Properties

Substrates

Keywords

Notes

SiO2 is a guess at the "highly conformal Plasma Enhanced Atomic Layer Deposition (PEALD) oxide liner."
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