Atomic Layer Deposition of Ruthenium and Ruthenium Oxide Using a Zero-Oxidation State Precursor
Type:
Journal
Info:
Chem. Mater. 2017, 29, 1107-1115
Date:
2017-01-17
Author Information
Name | Institution |
---|---|
Dustin Zachary Austin | Oregon State University |
Melanie A. Jenkins | Oregon State University |
Derryl Allman | ON Semiconductor |
Sallie Hose | ON Semiconductor |
David Price | ON Semiconductor |
Charles L. Dezelah | EMD Performance Materials |
John F. Conley, Jr. | Oregon State University |
Films
Thermal Ru
Thermal RuO2
Plasma RuO2
Film/Plasma Properties
Characteristic: Precursor Characterization
Analysis: TGA, Thermo Gravimetric Analysis
Characteristic: Precursor Vapor Pressure
Analysis: TGA, Thermo Gravimetric Analysis
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy
Substrates
SiO2 |
Notes
Avaiilable in thesis: Atomic Layer Deposition of Multi-Insulator Metal-Insulator-Metal Capacitors |
1069 |