Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper
Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2016, 8 (39), pp 26119-26125
Date:
2016-09-06
Author Information
| Name | Institution |
|---|---|
| Liang Gong Wen | IMEC |
| Philippe Roussel | IMEC |
| Olalla Varela Pedreira | IMEC |
| Basoene Briggs | IMEC |
| Benjamin Groven | IMEC |
| Shibesh Dutta | IMEC |
| Mihaela I. Popovici | IMEC |
| Nancy Heylen | IMEC |
| Ivan Ciofi | IMEC |
| Kris Vanstreels | IMEC |
| Frederik W. Østerberg | Technical University of Denmark |
| Ole Hansen | Technical University of Denmark |
| Dirch H. Petersen | Technical University of Denmark |
| Karl Opsomer | IMEC |
| Christophe Detavernier | Ghent University |
| Christopher J. Wilson | IMEC |
| Sven Van Elshocht | IMEC |
| Kristof Croes | IMEC |
| Jürgen Bömmels | IMEC |
| Zsolt Tőkei | IMEC |
| Christoph Adelmann | IMEC |
Films
Film/Plasma Properties
Substrates
Notes
| 794 |