Publication Information

Title: Atomic Layer Deposition of Ruthenium with TiN Interface for Sub-10 nm Advanced Interconnects beyond Copper

Type: Journal

Info: ACS Appl. Mater. Interfaces, 2016, 8 (39), pp 26119-26125

Date: 2016-09-06

DOI: http://dx.doi.org/10.1021/acsami.6b07181

Author Information

Name

Institution

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

Technical University of Denmark

Technical University of Denmark

Technical University of Denmark

IMEC

Ghent University

IMEC

IMEC

IMEC

IMEC

IMEC

IMEC

Films

Thermal Ru using Unknown

Deposition Temperature Range N/A

0-0-0

7782-44-7

Thermal TiN using Unknown

Deposition Temperature Range N/A

Plasma SiO2 using Unknown

Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Substrates

Keywords

Interconnect

Notes

794



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