Publication Information

Title:
Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma
Type:
Journal
Info:
Chem. Mater. 2015, 27, 5988-5996
Date:
2015-08-14

Author Information

Name Institution
Zheng GuoBeijing Institute of Graphic Communication
Hao LiPeking University
Qiang ChenBeijing Institute of Graphic Communication
Lijun SangBeijing Institute of Graphic Communication
Lizhen YangBeijing Institute of Graphic Communication
Zhongwei LiuBeijing Institute of Graphic Communication
Xinwei WangPeking University

Films

Plasma Cu


Film/Plasma Properties

Characteristic: Thickness
Analysis: Profilometry

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Deposition Kinetics, Reaction Mechanism
Analysis: QCM, Quartz Crystal Microbalance

Characteristic: Deposition Kinetics, Reaction Mechanism
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Microstructure
Analysis: Electron Diffraction

Substrates

Silicon
Glass

Keywords

Notes

504