copper(I)-N,N'-diisopropylacetamidinate, (Cu(amd)), CAS# 0-0-0
Plasma Enhanced Atomic Layer Deposition Film Publications
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| Number | Title |
|---|---|
| 1 | Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma |