Publication Information

Title:
Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 32, 031506 (2014)
Date:
2014-02-28

Author Information

Name Institution
Michael BurkeTyndall National Institute, University College Cork
Alan BlakeTyndall National Institute, University College Cork
Ian M. PoveyTyndall National Institute, University College Cork
Michael SchmidtTyndall National Institute, University College Cork
Nikolay PetkovTyndall National Institute, University College Cork
Patrick CarolanTyndall National Institute, University College Cork
Aidan J. QuinnTyndall National Institute, University College Cork

Films


Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: I-V, Current-Voltage Measurements

Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Substrates

SiO2

Keywords

Notes

n-type Si(100) substrates HF-dipped, O3 cleaned, and DI rinsed. 1 micron thermal SiO2 grown.
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