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Low sheet resistance titanium nitride films by low-temperature plasma-enhanced atomic layer deposition using design of experiments methodology
Type:
Journal
Info:
Journal of Vacuum Science & Technology A 32, 031506 (2014)
Date:
2014-02-28
Author Information
| Name | Institution |
|---|---|
| Michael Burke | Tyndall National Institute, University College Cork |
| Alan Blake | Tyndall National Institute, University College Cork |
| Ian M. Povey | Tyndall National Institute, University College Cork |
| Michael Schmidt | Tyndall National Institute, University College Cork |
| Nikolay Petkov | Tyndall National Institute, University College Cork |
| Patrick Carolan | Tyndall National Institute, University College Cork |
| Aidan J. Quinn | Tyndall National Institute, University College Cork |
Films
Plasma TiN
Film/Plasma Properties
Characteristic: Resistivity, Sheet Resistance
Analysis: I-V, Current-Voltage Measurements
Characteristic: Chemical Composition, Impurities
Analysis: TOF-SIMS, Time of Flight Secondary Ion Mass Spectrometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Substrates
| SiO2 |
Notes
| n-type Si(100) substrates HF-dipped, O3 cleaned, and DI rinsed. 1 micron thermal SiO2 grown. |
| 138 |