Publication Information

Title:
Preparation of TiN films by plasma assisted atomic layer deposition for copper metallization
Type:
Journal
Info:
Materials Science and Engineering C 24 (2004) 289-291
Date:
2003-10-27

Author Information

Name Institution
Do-Heyoung KimChonnam National University
Young Jae KimChonnam National University
Jun-Hyung ParkChonnam National University
Jin Hyeok KimChonnam National University

Films




Film/Plasma Properties

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Substrates

SiO2

Keywords

Notes

1240