Ultrahigh purity conditions for nitride growth with low oxygen content by plasma-enhanced atomic layer deposition

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 38, 062408 (2020)
Date:
2020-10-13

Author Information

Name Institution
Gilbert B. RaynerKurt J. Lesker Company
Noel O'TooleKurt J. Lesker Company
Jeffrey ShallenbergerThe Pennsylvania State University
Blaine JohsFilm Sense LLC

Films

Plasma TiN



Plasma AlN


Plasma SiNx


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Resistivity, Sheet Resistance
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Resistivity, Sheet Resistance
Analysis: Ellipsometry

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Compositional Depth Profiling
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Compositional Depth Profiling
Analysis: SIMS, Secondary Ion Mass Spectrometry

Substrates

Si with native oxide
SiO2

Notes

1538