Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition

Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2019, 11 (9), pp 9594-9599
Date:
2019-02-01

Author Information

Name Institution
Hyo Jin KimStanford University
Kirsten E. KaplanStanford University
Peter SchindlerStanford University
Shicheng XuStanford University
Martin M. WinterkornStanford University
David B. HeinzStanford University
Timothy S. EnglishStanford University
J ProvineStanford University
Fritz B. PrinzStanford University
Thomas W. KennyStanford University

Films




Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Surface Hydroxyl Concentration
Analysis: Contact Angle Measurement

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: TCR, Temperature Coefficient of Resistivity
Analysis: Four-point Probe

Characteristic: Nucleation
Analysis: TEM, Transmission Electron Microscope

Substrates

Al2O3
TiO2

Notes

1251