Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition
Type:
Journal
Info:
ACS Appl. Mater. Interfaces, 2019, 11 (9), pp 9594-9599
Date:
2019-02-01
Author Information
Name | Institution |
---|---|
Hyo Jin Kim | Stanford University |
Kirsten E. Kaplan | Stanford University |
Peter Schindler | Stanford University |
Shicheng Xu | Stanford University |
Martin M. Winterkorn | Stanford University |
David B. Heinz | Stanford University |
Timothy S. English | Stanford University |
J Provine | Stanford University |
Fritz B. Prinz | Stanford University |
Thomas W. Kenny | Stanford University |
Films
Plasma Al2O3
Plasma TiO2
Plasma Pt
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Surface Hydroxyl Concentration
Analysis: Contact Angle Measurement
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: TCR, Temperature Coefficient of Resistivity
Analysis: Four-point Probe
Characteristic: Nucleation
Analysis: TEM, Transmission Electron Microscope
Substrates
Al2O3 |
TiO2 |
Notes
1251 |