Publication Information

Title: Electrical Properties of Ultrathin Platinum Films by Plasma-Enhanced Atomic Layer Deposition

Type: Journal

Info: ACS Appl. Mater. Interfaces, 2019, 11 (9), pp 9594-9599

Date: 2019-02-01

DOI: http://dx.doi.org/10.1021/acsami.8b21054

Author Information

Name

Institution

Stanford University

Stanford University

Stanford University

Stanford University

Stanford University

Stanford University

Stanford University

Stanford University

Stanford University

Stanford University

Films

Deposition Temperature = 200C

75-24-1

7782-44-7

Deposition Temperature = 200C

3275-24-9

7782-44-7

Deposition Temperature = 270C

94442-22-5

7782-44-7

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Thickness

Ellipsometry

J.A. Woollam M-2000

Thickness

XRR, X-Ray Reflectivity

PANalytical Xpert PRO MPD X-ray Diffractometer

Morphology, Roughness, Topography

AFM, Atomic Force Microscopy

Park Systems, XE-100

Chemical Composition, Impurities

XPS, X-ray Photoelectron Spectroscopy

PHI VersaProbe 5000

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

Electron Diffraction

FEI Tecnai G2 F20 S-Twin

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

TEM, Transmission Electron Microscope

FEI Tecnai G2 F20 S-Twin

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

PANalytical Xpert PRO MPD X-ray Diffractometer

Surface Hydroxyl Concentration

Contact Angle Measurement

Ramé-Hart 290

Resistivity, Sheet Resistance

Four-point Probe

KLA-Tencor Omnimap RS35c

TCR, Temperature Coefficient of Resistivity

Four-point Probe

KLA-Tencor Omnimap RS35c

Nucleation

TEM, Transmission Electron Microscope

FEI Tecnai G2 F20 S-Twin

Substrates

Al2O3

TiO2

Keywords

Nucleation

Notes

1251



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