Publication Information

Title:
Plasma-enhanced atomic layer deposition of TiCx films using tetrakis neopentyl titanium and applications to a diffusion barrier and contact material
Type:
Presentation
Info:
ALD 2012 Talk
Date:
2012-06-18
DOI:
No DOI

Author Information

Name Institution
Sang-Kyung ChoiYeungnam University
Soo-Hyun KimYeungnam University
Taehoon CheonDaegu Gyeongbuk Institute of Science & Technology

Films

Plasma TiC


Plasma TiN


Film/Plasma Properties

Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity

Characteristic: Chemical Composition, Impurities
Analysis: AES, Auger Electron Spectroscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Resistivity, Sheet Resistance
Analysis: -

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope

Characteristic: Diffusion Barrier Properties
Analysis: Anneal

Substrates

Silicon

Keywords

Diffusion Barrier

Notes

Samples annealed 700-1000C, 5e-6Torr, 30min.
90