Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Self Assembled Metamaterials Formed via Plasma Enhanced ALD of Ag Thin Films

Type:
Conference Proceedings
Info:
ECS Trans. 2014 volume 64, issue 9, 279-289
Date:
2014-10-08
DOI:
http://dx.doi.org/10.1149/06409.0279ecst

Author Information

Name Institution
Sharka M. ProkesU.S. Naval Research Laboratory

Films

Plasma Ag

Hardware used: Beneq TFS-200
Ag(FOD)(PEt3), Triethylphosphine (6,6,7,7,8,8,8- heptafluoro-2,2- dimethyl-3,5- octanedionate) silver(I)
CAS#: 165461-74-5
Where to buy precursor
H2, Hydrogen
CAS#: 1333-74-0

Where to buy onsite generators

Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Resistivity, Sheet Resistance
Analysis: -
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: -

Characteristic: Thickness
Analysis: Ellipsometry
Diagnostic: -

Characteristic: Thickness
Analysis: AFM, Atomic Force Microscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: -

Substrates

Notes

Beneq TFS-200 PEALD Ag for plasmonic study.
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