About Plasma ALD, LLC

The Plasma Enhanced Atomic Layer Deposition Publication Database is developed and maintained by Plasma ALD, LLC, a developer and supplier of inductively coupled plasma (ICP) sources for plasma-enhanced atomic layer deposition (PEALD), atomic layer etch (ALE), thin-film etching, surface cleaning, surface modification, and research plasma systems.

Our ICP sources are designed for integration with existing ALD and vacuum-processing equipment. Plasma ALD also provides plasma-source integration, process-development, and troubleshooting assistance based on decades of experience with low-pressure plasma processing and PEALD systems.

Researchers, universities, equipment manufacturers, and laboratories looking for an ICP plasma source or assistance adding plasma capability to a vacuum system can learn more on our Plasma Sources page.

Plasma treatment to tailor growth and photoelectric performance of plasma-enhanced atomic layer deposition SnOx infrared transparent conductive thin films

Type:
Journal
Info:
Surface & Coatings Technology 403 (2020) 126414
Date:
2020-09-10

Author Information

Name Institution
Liangge XuHarbin Institute of Technology
Lili HeHarbin Institute of Technology
Lei YangHarbin Institute of Technology
Zhibo ZhangHarbin Institute of Technology
Shuai GuoHarbin Institute of Technology
Zhenhuai YangHarbin Institute of Technology
Peng WangHarbin Institute of Technology
Fangjuan GengHarbin Institute of Technology
Gang GaoHarbin Institute of Technology
Chunqiang SunHarbin Institute of Technology
Victor RalchenkoHarbin Institute of Technology
Jiaqi ZhuHarbin Institute of Technology

Films

Plasma SnO2


Plasma SnO2


Film/Plasma Properties

Characteristic: Thickness
Analysis: -

Characteristic: Refractive Index
Analysis: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Morphology, Roughness, Topography
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Transmittance
Analysis: FTIR, Fourier Transform InfraRed spectroscopy

Characteristic: Transmittance
Analysis: UV-VIS Spectroscopy

Characteristic: Mobility
Analysis: Hall Measurements

Characteristic: Carrier Concentration
Analysis: Hall Measurements

Characteristic: Resistivity, Sheet Resistance
Analysis: Hall Measurements

Characteristic: Electromagnetic Shielding
Analysis: Vector Network Analysis

Characteristic: Stress
Analysis: Stress Measurement

Characteristic: Raman Spectra
Analysis: Raman Spectroscopy

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy

Substrates

Silicon
Quartz
Sapphire

Notes

1599