Energetic ions during plasma-enhanced atomic layer deposition and their role in tailoring material properties

Type:
Journal
Info:
Plasma Sources Sci. Technol. 28 (2019) 024002
Date:
2018-11-21

Author Information

Name Institution
Tahsin FarazEindhoven University of Technology
Karsten ArtsEindhoven University of Technology
Saurabh KarwalEindhoven University of Technology
Harm C. M. KnoopsEindhoven University of Technology
Erwin (W.M.M.) KesselsEindhoven University of Technology

Films



Plasma SiNx


Film/Plasma Properties

Characteristic: Ion Energy
Analysis: RFEA, Retarding Field Energy Analyzer

Characteristic: Ion Flux
Analysis: Custom

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Refractive Index
Analysis: Ellipsometry

Characteristic: Extinction Coefficient
Analysis: Ellipsometry

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Stress
Analysis: Wafer Curvature

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Wet Etch Resistance
Analysis: TEM, Transmission Electron Microscope

Substrates

SiO2

Notes

1278