Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 31, 01A137 (2013)
Date:
2012-11-14

Author Information

Name Institution
Nigamananda SamalVeeco Instruments
Hui DuVeeco Instruments
Russell LuberoffVeeco Instruments
Krishna ChetryVeeco Instruments
Randhir BubberVeeco Instruments
Alan HayesVeeco Instruments
Adrian DevasahayamVeeco Instruments

Films


Film/Plasma Properties

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Optical Properties
Analysis: Ellipsometry

Characteristic: Stress
Analysis: Stress Measurement

Characteristic: Etch Rate
Analysis: Custom

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy

Characteristic: Adhesion
Analysis: Tape Test

Substrates

SiO2

Keywords

Notes

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