Low-temperature (≤200°C) plasma enhanced atomic layer deposition of dense titanium nitride thin films

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 31, 01A137 (2013)
Date:
2012-11-14
DOI:
http://dx.doi.org/10.1116/1.4769204

Author Information

Name Institution
Nigamananda SamalVeeco Instruments
Hui DuVeeco Instruments
Russell LuberoffVeeco Instruments
Krishna ChetryVeeco Instruments
Randhir BubberVeeco Instruments
Alan HayesVeeco Instruments
Adrian DevasahayamVeeco Instruments

Films

Plasma TiN

Hardware used: Veeco NEXUS
TDMATi, tetrakis(dimethylamido)titanium, titanium dimethylamide, (Me2N)4Ti
CAS#: 3275-24-9
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H2, Hydrogen
CAS#: 1333-74-0

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Deposition Temperature Range = 150-200C

Film/Plasma Properties

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: GIXRD, Grazing Incidence X-Ray Diffraction
Diagnostic: PANalytical Xpert PRO MRD X-ray Diffractometer

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Diagnostic: PANalytical Xpert PRO MRD X-ray Diffractometer

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Diagnostic: 4D 280 4 Point Probe

Characteristic: Optical Properties
Analysis: Ellipsometry
Diagnostic: J.A. Woollam EC400

Characteristic: Stress
Analysis: Stress Measurement
Diagnostic: Tencor FLX-2320 A

Characteristic: Etch Rate
Analysis: Custom
Diagnostic: Custom

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: Electron Diffraction
Diagnostic: -

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry
Diagnostic: -

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Chemical Binding
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Adhesion
Analysis: Tape Test
Diagnostic: -

Substrates

SiO2

Notes

656