Growth mechanism and electrical properties of tungsten films deposited by plasma-enhanced atomic layer deposition with chloride and metal organic precursors
Type:
Journal
Info:
Applied Surface Science 568 (2021) 150939
Date:
2021-08-10
Author Information
Name | Institution |
---|---|
Yujin Lee | Yonsei University |
Seunggi Seo | Yonsei University |
Taewook Nam | Yonsei University |
Hyunho Lee | Yonsei University |
Hwi Yoon | Yonsei University |
Sangkyu Sun | Yonsei University |
Il-Kwon Oh | Yonsei University |
Sanghun Lee | Yonsei University |
Bonggeun Shong | Hongik University |
Jin Hyung Seo | Hansol Chemical |
Jang Hyeon Seok | Hansol Chemical |
Hyungjun Kim | Yonsei University |
Films
Plasma W
Plasma W
Film/Plasma Properties
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Conformality, Step Coverage
Analysis: SEM, Scanning Electron Microscopy
Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
SiO2 |
Notes
1707 |