Remote Plasma and Thermal ALD of Platinum and Platinum Oxide Films
Type:
Presentation
Info:
ALD 2009
Date:
2008-11-03
DOI:
No DOI
Author Information
Name | Institution |
---|---|
Harm C. M. Knoops | Eindhoven University of Technology |
Adriaan J. M. Mackus | Eindhoven University of Technology |
Merijn E. Donders | Eindhoven University of Technology |
Mauritius C. M. (Richard) van de Sanden | Eindhoven University of Technology |
Peter H. L. Notten | Eindhoven University of Technology |
Erwin (W.M.M.) Kessels | Eindhoven University of Technology |
Films
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Thickness
Analysis: XRR, X-Ray Reflectivity
Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
Si(100) |
SiO2 |
Notes
Pt and PtO2 process the same except PtO2 has longer O2 plasma step. |
Same content as paper in database with similar name. |
Showed 16:1 conformal Pt deposition. |
Database entry based entirely on presentation pdf. Recorded talk was not reviewed. |
68 |