Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier

Type:
Journal
Info:
Electrochemical and Solid-State Letters, 10 (1) D13-D16 (2007)
Date:
2006-08-22

Author Information

Name Institution
Nicole E. LayRensselaer Polytechnic Institute (RPI)
Gregory A. Ten EyckRensselaer Polytechnic Institute (RPI)
David J. DuquetteRensselaer Polytechnic Institute (RPI)
Toh-Ming LuRensselaer Polytechnic Institute (RPI)

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Adhesion
Analysis: Tape Test

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Substrates

TaN

Notes

1320