Direct Plating of Cu on Pd Plasma Enhanced Atomic Layer Deposition Coated TaN Barrier
Type:
Journal
Info:
Electrochemical and Solid-State Letters, 10 (1) D13-D16 (2007)
Date:
2006-08-22
Author Information
| Name | Institution |
|---|---|
| Nicole E. Lay | Rensselaer Polytechnic Institute (RPI) |
| Gregory A. Ten Eyck | Rensselaer Polytechnic Institute (RPI) |
| David J. Duquette | Rensselaer Polytechnic Institute (RPI) |
| Toh-Ming Lu | Rensselaer Polytechnic Institute (RPI) |
Films
Plasma Pd
Film/Plasma Properties
Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry
Characteristic: Adhesion
Analysis: Tape Test
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Substrates
| TaN |
Notes
| 1320 |