Publication Information

Title:
Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
Type:
Journal
Info:
Thin Solid Films 649 (2018) 24 - 29
Date:
2018-01-13

Author Information

Name Institution
Michael T. BarakoStanford University
Timothy S. EnglishStanford University
Shilpi Roy-PanzerStanford University
Thomas W. KennyStanford University
K. E. GoodsonStanford University

Films


Film/Plasma Properties

Characteristic: Thickness
Analysis: Ellipsometry

Characteristic: Uniformity
Analysis: Ellipsometry

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Electrical Isolation
Analysis: Four-point Probe

Substrates

SiO2
Pt

Keywords

Notes

1219