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Plasma-enhanced atomic layer deposition of gallium nitride thin films on fluorine-doped tin oxide glass substrate for future photovoltaic application
Plasma enhanced atomic layer deposition of thin film Li1+xMn2-xO4 for realization of all solid-state 3D lithium-ion microbatteries
AlN PEALD with TMA and forming gas: study of plasma reaction mechanisms
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Dielectric barrier layers by low-temperature plasma-enhanced atomic layer deposition of silicon dioxide
Type:
Journal
Info:
Thin Solid Films 649 (2018) 24 - 29
Date:
2018-01-13
Author Information
| Name | Institution |
|---|---|
| Michael T. Barako | Stanford University |
| Timothy S. English | Stanford University |
| Shilpi Roy-Panzer | Stanford University |
| Thomas W. Kenny | Stanford University |
| K. E. Goodson | Stanford University |
Films
Plasma SiO2
Film/Plasma Properties
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Uniformity
Analysis: Ellipsometry
Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Characteristic: Electrical Isolation
Analysis: Four-point Probe
Substrates
| SiO2 |
| Pt |
Keywords
Notes
| 1219 |
Popular Precursors
Top Authors
| Erwin (W.M.M.) Kessels |
| Hyeongtag Jeon |
| Hyungjun Kim |
| Mauritius C. M. (Richard) van de Sanden |
| Christophe Detavernier |