Publication Information

Title: Advanced characterizations of fluorine-free tungsten film and its application as low resistance liner for PCRAM

Type: Journal

Info: Materials Science in Semiconductor Processing 71 (2017) 433-440

Date: 2017-08-27

DOI: https://doi.org/10.1016/j.mssp.2017.08.033

Author Information

Name

Institution

Grenoble Alps University (UGA)

Grenoble Alps University (UGA)

STMicroelectronics

STMicroelectronics

Applied Materials

Grenoble Alps University (UGA)

STMicroelectronics

Grenoble Alps University (UGA)

Grenoble Alps University (UGA)

Grenoble Alps University (UGA)

Grenoble Alps University (UGA)

Grenoble Alps University (UGA)

Grenoble Alps University (UGA)

Films

Deposition Temperature = 180C

14040-11-0

1333-74-0

Film/Plasma Properties

Characteristic

Analysis

Diagnostic

Resistivity, Sheet Resistance

Four-point Probe

Napson WS-3000

Thickness

XRR, X-Ray Reflectivity

Jordan Valley JVX 5200

Crystallinity, Crystal Structure, Grain Size, Atomic Structure

XRD, X-Ray Diffraction

Rigaku Smartlab

Compositional Depth Profiling

PPTOFMS, Plasma Profiling Time Of Flight Mass Spectrometry

Horiba Jobin Yvon Plasma Profiling Time Of Flight Mass Spectrome

Compositional Depth Profiling

WDXRF, Wavelength Dispersive X-ray Fluorescence

Rigaku AZX400 Sequential WDXRF Spectrometer

Images

SEM, Scanning Electron Microscopy

Hitachi S-5500

Conformality, Step Coverage

SEM, Scanning Electron Microscopy

Hitachi S-5500

Images

TEM, Transmission Electron Microscope

-

Contact Resistance

Two-point Probe

-

Substrates

SiO2

W

Keywords

Notes

1065



Shortcuts



© 2014-2019 plasma-ald.com