Comparison of thermal, plasma-enhanced and layer by layer Ar plasma treatment atomic layer deposition of Tin oxide thin films

Type:
Journal
Info:
Journal of Crystal Growth 572 (2021) 126264
Date:
2021-07-21

Author Information

Name Institution
Liangge XuHarbin Institute of Technology
Zhibo ZhangHarbin Institute of Technology
Lei YangHarbin Institute of Technology
Jinye YangHarbin Institute of Technology
Peng WangHarbin Institute of Technology
Gang GaoHarbin Institute of Technology
Chunqiang SunHarbin Institute of Technology
Victor RalchenkoHarbin Institute of Technology
Jiaqi ZhuHarbin Institute of Technology

Films




Film/Plasma Properties

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Images
Analysis: TEM, Transmission Electron Microscope

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope

Characteristic: Carrier Concentration
Analysis: Hall Measurements

Characteristic: Mobility
Analysis: Hall Measurements

Characteristic: Resistivity, Sheet Resistance
Analysis: Hall Measurements

Characteristic: Surface Potential
Analysis: AFM, Atomic Force Microscopy

Characteristic: Stress
Analysis: Wafer Curvature

Substrates

Silicon
Sapphire

Keywords

Plasma vs Thermal Comparison

Notes

1619