Plasma-enhanced atomic layer deposition of tantalum thin films: the growth and film properties

Type:
Journal
Info:
Thin Solid Films 441 (2003) 311 - 316
Date:
2003-05-30

Author Information

Name Institution
Hyungjun KimIBM
S. M. RossnagelIBM

Films

Plasma Ta


Film/Plasma Properties

Characteristic: Plasma Species
Analysis: OES, Optical Emission Spectroscopy

Characteristic: Gas Phase Species
Analysis: QMS, Quadrupole Mass Spectrometer

Characteristic: Chemical Composition, Impurities
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Thickness
Analysis: RBS, Rutherford Backscattering Spectrometry

Characteristic: Chemical Composition, Impurities
Analysis: FRES, Forward Recoil Elastic Spectrometry

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe

Characteristic: Microstructure
Analysis: XRD, X-Ray Diffraction

Characteristic: Microstructure
Analysis: SEM, Scanning Electron Microscopy

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope

Substrates

Si(001)
SiO2

Notes

1233