Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

Contact us for more information.


Film Uniformity in Atomic Layer Deposition

Type:
Journal
Info:
Chem. Vap. Deposition 2006, 12, 13-24
Date:
2005-10-05
DOI:
http://dx.doi.org/10.1002/cvde.200500024

Author Information

Name Institution
Kai-Erik ElersASM Microchemistry Oy
Tom BlombergASM Microchemistry Oy
M. PeussaVTI Technologies Oy
B. AitchisonMLD Technologies, LLC
Suvi HaukkaASM Microchemistry Oy
Steven MarcusASM Microchemistry Oy

Films

Plasma TiN

Hardware used: Custom Direct Capacitively Coupled Plasma
TiCl4, Titanium Tetrachloride
CAS#: 7550-45-0
Where to buy precursor
N2, Nitrogen
CAS#: 7727-37-9
H2, Hydrogen
CAS#: 1333-74-0

Where to buy onsite generators

Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Uniformity
Analysis: -
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -
Diagnostic: -

Substrates

Notes

1307