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Platinum thin films with good thermal and chemical stability fabricated by inductively coupled plasma-enhanced atomic layer deposition at low temperatures

Type:
Journal
Info:
Thin Solid Films, Volume 566, 1 September 2014, Pages 93-98
Date:
2014-07-17
DOI:
http://dx.doi.org/10.1016/j.tsf.2014.07.031

Author Information

Name Institution
Bo-Heng LiuNational Applied Research Laboratories

Films

Plasma Pt

Hardware used: Unknown
Deposition Temperature = 200C

Film/Plasma Properties

Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Diagnostic: Rigaku TTRAX III

Characteristic: Chemical Composition, Impurities
Analysis: XPS, X-ray Photoelectron Spectroscopy
Diagnostic: -

Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: XRD, X-Ray Diffraction
Diagnostic: Rigaku TTRAX III

Characteristic: Conformality, Step Coverage
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: -
Diagnostic: -

Characteristic: Morphology, Roughness, Topography
Analysis: AFM, Atomic Force Microscopy
Diagnostic: Veeco Dimension 3100

Characteristic: Thickness
Analysis: -
Diagnostic: -

Substrates

Glass
Silicon

Notes

PEALD Pt deposition for catalyst application.
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