Introducing Plasma ALD, LLC's first in-house product.

An economical, compact inductively coupled plasma source.

Ideal for:
  • Plasma-Enhanced Atomic Layer Deposition
  • Thin Film Etch
  • Surface cleaning
  • Surface modification

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Atmospheric pressure plasma enhanced spatial ALD of silver

Type:
Journal
Info:
Journal of Vacuum Science & Technology A 33, 01A131 (2015)
Date:
2014-11-13
DOI:
http://dx.doi.org/10.1116/1.4902561

Author Information

Name Institution
Fieke J. van den BrueleTNO
Mireille SmetsTNO
Andrea IlliberiTNO
Yves CreyghtonTNO
Pascal BuskensTNO
Fred RoozeboomTNO
Paul PoodtTNO

Films

Plasma Ag

Hardware used: Custom
Ag(FOD)(PEt3), Triethylphosphine (6,6,7,7,8,8,8- heptafluoro-2,2- dimethyl-3,5- octanedionate) silver(I)
CAS#: 165461-74-5
Where to buy precursor
N2, Nitrogen
CAS#: 7727-37-9
H2, Hydrogen
CAS#: 1333-74-0

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Deposition Temperature Range N/A

Film/Plasma Properties

Characteristic: Thickness
Analysis: Profilometry
Diagnostic: Dektak

Characteristic: Chemical Composition, Impurities
Analysis: EDS, EDX, Energy Dispersive X-ray Spectroscopy
Diagnostic: -

Characteristic: Microstructure
Analysis: TEM, Transmission Electron Microscope
Diagnostic: -

Characteristic: Resistivity, Sheet Resistance
Analysis: Four-point Probe
Diagnostic: -

Characteristic: Images
Analysis: SEM, Scanning Electron Microscopy
Diagnostic: -

Characteristic: Optical Properties
Analysis: Ellipsometry
Diagnostic: J.A. Woollam M-2000

Substrates

Silicon

Notes

Surface Dielectric Barrier Discharge (SDBD) plasma used.
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