Capacitance Plasma Enhanced Atomic Layer Deposition Publications

Your search for plasma enhanced atomic layer deposition publications discussing Capacitance returned 138 record(s). If there are too many results, you may want to use the multi-factor search to narrow the results.

NumberTitle
1Interfacial Self-Cleaning during PEALD HfO2 Process on GaAs Using TDMAH/O2 with Different (NH4)2S Cleaning Time
2AlN passivation by plasma-enhanced atomic layer deposition for GaN-based power switches and power amplifiers
3Radical Enhanced Atomic Layer Deposition of Titanium Dioxide - Thesis Coverage
4Efficiency Enhancement of Nanotextured Black Silicon Solar Cells Using Al2O3/TiO2 Dual-Layer Passivation Stack Prepared by Atomic Layer Deposition
5Comparative study on interface and bulk charges in AlGaN/GaN metal-insulator-semiconductor heterostructures with Al2O3, AlN, and Al2O3/AlN laminated dielectrics
6Electrical Characteristics of n, p-In0.53Ga0.47As MOSCAPs With In Situ PEALD-AlN Interfacial Passivation Layer
7The Effects of Annealing Ambient on the Characteristics of La2O3 Films Deposited by RPALD
8ZrO2 Gate Dielectric Deposited by Plasma-Enhanced Atomic Layer Deposition Method
9Damage free Ar ion plasma surface treatment on In0.53Ga0.47As-on-silicon metal-oxide-semiconductor device
10Comparison of the Deposition Characteristics and Electrical Properties for La2O3, HfO2 and LHO Films
11Effects of H2 plasma and annealing on atomic-layer-deposited Al2O3 films and Al/Al2O3/Si structures
12Atomic layer deposition of Al2O3 on GaSb using in situ hydrogen plasma exposure
13Nanochemistry, nanostructure, and electrical properties of Ta2O5 film deposited by atomic layer deposition and plasma-enhanced atomic layer deposition
14High Mobility (210cm2/Vs), High Capacitance (7.2uF/cm2) ZrO2 on GaN Metal Oxide Semiconductor Capacitor via ALD
15Three dimensional ALD of TiO2 for in-vivo biomedical sensor applications
16Characteristics of ALD-GZO Films with Driven-in Zn and Zn/Mg Sources for the Applications to Optoelectronic Devices
17Effect of NH3 plasma passivation on the electrical characteristics of a nanolaminated ALD HfAlO on InGaAs MOS capacitor
18Plasma-Enhanced Atomic Layer Deposition of Silicon Nitride Using a Novel Silylamine Precursor
19ALD titanium nitride coated carbon nanotube electrodes for electrochemical supercapacitors
20Properties of HfLaO MOS capacitor deposited on SOI with plasma enhanced atomic layer deposition
21Incorporating Yttrium into a GeO Interfacial Layer with HfO2-Based Gate Stack on Ge
22Dielectric properties investigation of a compound based on atomic layer deposited multi-layer structure
23Self-formation of dielectric layer containing CoSi2 nanocrystals by plasma-enhanced atomic layer deposition
24Low Dit HfO2/Al2O3/In0.53Ga0.47As gate stack achieved with plasma-enhanced atomic layer deposition
25Improved dielectric properties of BeO thin films grown by plasma enhanced atomic layer deposition
26Tailoring the Electrical Properties of HfO2 MOS-Devices by Aluminum Doping
27Fast PEALD ZnO Thin-Film Transistor Circuits
28Surface Passivation of Silicon Using HfO2 Thin Films Deposited by Remote Plasma Atomic Layer Deposition System
29Ultra low density of interfacial traps with mixed thermal and plasma enhanced ALD of high-k gate dielectrics
30High quality HfO2/p-GaSb(001) metal-oxide-semiconductor capacitors with 0.8nm equivalent oxide thickness
31Influence of plasma on electrophysical properties of the GaP/n-Si isotype heterojunction grown by PE-ALD
32Influence of PE-ALD of GaP on the Silicon Wafers Quality
33Improvement of Vth Instability in Normally-Off GaN MIS-HEMTs Employing PEALD-SiNx as an Interfacial Layer
34Wideband frequency and in situ characterization of ultra thin ZrO2 and HfO2 films for integrated MIM capacitors
35Capacitance characterization of GaP/n-Si structures grown by PE-ALD
36Composition, structure, and electrical characteristics of HfO2 gate dielectrics grown using the remote- and direct-plasma atomic layer deposition methods
37In-gap states in titanium dioxide and oxynitride atomic layer deposited films
38Radical Enhanced Atomic Layer Deposition of Titanium Dioxide
39Sub-nanometer heating depth of atomic layer annealing
40Correlation between ferroelectricity and ferroelectric orthorhombic phase of HfxZr1-xO2 thin films using synchrotron x-ray analysis
41Low-Temperature Deposition of Aluminum Oxide by Radical Enhanced Atomic Layer Deposition - Thesis Coverage
42Experimental and theoretical determination of the role of ions in atomic layer annealing
43Electrical characteristics and step coverage of ZrO2 films deposited by atomic layer deposition for through-silicon via and metal-insulator-metal applications
44Characteristics of HfO2 thin films grown by plasma atomic layer deposition
45The influence of surface preparation on low temperature HfO2 ALD on InGaAs (001) and (110) surfaces
46Effective work function tunability and interfacial reactions with underlying HfO2 layer of plasma-enhanced atomic layer deposited TaCxNy films
47Back-End, CMOS-Compatible Ferroelectric Field-Effect Transistor for Synaptic Weights
48Interfacial, Electrical, and Band Alignment Characteristics of HfO2/Ge Stacks with In Situ-Formed SiO2 Interlayer by Plasma-Enhanced Atomic Layer Deposition
49Comparative Studies of Atomic Layer Deposition and Plasma-Enhanced Atomic Layer Deposition Ta2O5 and the Effects on Electrical Properties of In situ Nitridation
50High aspect ratio iridescent three-dimensional metal-insulator-metal capacitors using atomic layer deposition
51Growth Characteristics and Film Properties of Cerium Dioxide Prepared by Plasma-Enhanced Atomic Layer Deposition
52In situ plasma enhanced atomic layer deposition half cycle study of Al2O3 on AlGaN/GaN high electron mobility transistors
53Crystalline AlN Interfacial Layer on GaN Using Plasma-Enhanced Atomic Layer Deposition
54Plasma-Enhanced Atomic Layer Deposition of AlN Epitaxial Thin Film for AlN/GaN Heterostructure TFTs
55Lanthanum-Oxide Thin Films Deposited by Plasma-Enhanced Atomic Layer Deposition
56Structural and Electrical Analysis of Thin Interface Control Layers of MgO or Al2O3 Deposited by Atomic Layer Deposition and Incorporated at the high-k/III-V Interface of MO2/InxGa1-xAs (M = Hf|Zr, x = 0|0.53) Gate Stacks
57Improvement of smooth surface of RuO2 bottom electrode on Al2O3 buffer layer and characteristics of RuO2/TiO2/Al2O3/TiO2/RuO2 capacitors
58Integration of microwave-annealed oxidation on germanium metal-oxide-semiconductor devices
59The effects of plasma treatment on the thermal stability of HfO2 thin films
60Formation of Al2O3 Film on Si Substrate by Microwave Generated Remote Plasma Assisted Atomic Layer Deposition Technique
61Plasma-enhanced atomic layer deposition of ruthenium metal on free-standing carbon nanotube forest for 3D flexible binder-less supercapacitor electrodes
62Electrical and optical properties of TiO2 thin films prepared by plasma-enhanced atomic layer deposition
63Fermi level unpinning of GaSb (100) using plasma enhanced atomic layer deposition of Al2O3
64Preliminary investigation of high-k materials - TiO2 doped Ta2O5 films by remote plasma ALD
65Impact of oxygen plasma postoxidation process on Al2O3/n-In0.53Ga0.47As metal-oxide-semiconductor capacitors
66Impact of nitrogen depth profiles on the electrical properties of crystalline high-K gate dielectrics
67ALD titanium nitride on vertically aligned carbon nanotube forests for electrochemical supercapacitors
68Plasma Enhanced Atomic Layer Deposition of Al2O3/SiO2 MIM Capacitors
69Radical Enhanced Atomic Layer Deposition of Tantalum Oxide - Thesis Coverage
70Nitride passivation of the interface between high-k dielectrics and SiGe
71MOS Capacitance Measurements for PEALD TiO2 Dielectric Films Grown under Different Conditions and the Impact of Al2O3 Partial-Monolayer Insertion
72A study of the impact of in-situ argon plasma treatment before atomic layer deposition of Al2O3 on GaN based metal oxide semiconductor capacitor
73Comparison between thermal and plasma enhanced atomic layer deposition processes for the growth of HfO2 dielectric layers
74Low-Temperature Growth of SiO2 Films by Plasma-Enhanced Atomic Layer Deposition
75PEALD of Zirconium Oxide Using Tetrakis(ethylmethylamino)zirconium and Oxygen
76Effects of Recessed-Gate Structure on AlGaN/GaN-on-SiC MIS-HEMTs with Thin AlOxNy MIS Gate
77Suppression of GeOx interfacial layer and enhancement of the electrical performance of the high-K gate stack by the atomic-layer-deposited AlN buffer layer on Ge metal-oxide-semiconductor devices
78Al2O3/SiO2 nanolaminate for a gate oxide in a GaN-based MOS device
79Characterization of HfOxNy thin film formation by in-situ plasma enhanced atomic layer deposition using NH3 and N2 plasmas
80Interaction of hydrogen with hafnium dioxide grown on silicon dioxide by the atomic layer deposition technique
81Atomic Layer Deposition and Electrical Properties of SrTiO3 Thin Films Grown Using Sr(C11H19O2)2, Ti(Oi-C3H7)4, and H2O
82Performance enhancement of InAsSb QW-MOSFETs with in-situ H2 plasma cleaning for gate stack formation
83Comparative study on growth characteristics and electrical properties of ZrO2 films grown using pulsed plasma-enhanced chemical vapor deposition and plasma-enhanced atomic layer deposition for oxide thin film transistors
84Schottky Diodes on ZnO Thin Films Grown by Plasma-Enhanced Atomic Layer Deposition
85Spontaneous formation of aluminum germanate on Ge(100) by atomic layer deposition with trimethylaluminum and microwave-generated atomic oxygen
86Characteristics of HfO2 thin films deposited by plasma-enhanced atomic layer deposition using O2 plasma and N2O plasma
87Low EOT GeO2/Al2O3/HfO2 on Ge substrate using ultrathin Al deposition
88Plasma Enhanced Atomic Layer Deposition Passivated HfO2/AlN/In0.53Ga0.47As MOSCAPs With Sub-Nanometer Equivalent Oxide Thickness and Low Interface Trap Density
89In situ dry cleaning of Si wafer using OF2/NH3 remote plasma with low global warming potential
90Performance and retention characteristics of nanocrystalline Si floating gate memory with an Al2O3 tunnel layer fabricated by plasma-enhanced atomic layer deposition
91Structural and electrical properties of AlN thin films on GaN substrates grown by plasma enhanced-Atomic Layer Deposition
92Effective work function modulation of the bilayer metal gate stacks by the Hf-doped thin TiN interlayer prepared by the in-situ atomic layer doping technique
93Highly transparent low capacitance plasma enhanced atomic layer deposition Al2O3-HfO2 tunnel junction engineering
94Improved Electrical Properties of Crystalline ZrO2/Al2O3 Buffer Gate Stack with Double Nitridation
95Influence of plasma-based in-situ surface cleaning procedures on HfO2/In0.53Ga0.47As gate stack properties
96MANOS performance dependence on ALD Al2O3 oxidation source
97Charge trapping characteristics of Au nanocrystals embedded in remote plasma atomic layer-deposited Al2O3 film as the tunnel and blocking oxides for nonvolatile memory applications
98Epitaxially grown crystalline Al2O3 interlayer on β-Ga2O3 (010) and its suppressed interface state density
99Effect of Nitrogen Incorporation in HfO2 Films Deposited by Plasma-Enhanced Atomic Layer Deposition
100Interface Properties of GaP/Si Heterojunction Fabricated by PE-ALD
101A Silicon Nitride MIM Capacitor for Analog/Mixed-Signal Integrated Circuit using Manufacturable Atomic Layer Deposition Equipment
102Effects of rapid thermal annealing on the properties of AlN films deposited by PEALD on AlGaN/GaN heterostructures
103Al2O3 Insertion Layer for Improved PEALD SiO2/(Al)GaN Interfaces
104Electrical Comparison of HfO2 and ZrO2 Gate Dielectrics on GaN
105The Formation of an Almost Full Atomic Monolayer via Surface Modification by N2O-Plasma in Atomic Layer Deposition of ZrO2 Thin Films
106AlN epitaxy on SiC by low-temperature atomic layer deposition via layer-by-layer, in situ atomic layer annealing
107High-k GaAs metal insulator semiconductor capacitors passivated by ex-situ plasma-enhanced atomic layer deposited AlN for Fermi-level unpinning
108Characterization of thin Al2O3/SiO2 dielectric stack for CMOS transistors
109Tetragonal Zirconia Stabilization by Metal Addition for Metal-Insulator-Metal Capacitor Applications
110Degradation of the surface passivation of plasma-assisted ALD Al2O3 under damp-heat exposure
111Impact of AlN Interfacial Dipole on Effective Work Function of Ni and Band Alignment of Ni/HfO2/In0.53Ga0.47As Gate-Stack
112Capacitance-voltage characterization of Al2O3/GaN-on-insulator (GaNOI) structures with TMAH surface treatment
113A comparative study of AlN and Al2O3 based gate stacks grown by atomic layer deposition on InGaAs
114Dielectric Properties of Thermal and Plasma-Assisted Atomic Layer Deposited Al2O3 Thin Films
115Electrical Characterization of Metal-Insulator-Semiconductor Capacitors Having Double-Layered Atomic-Layer-Deposited Al2O3 and ZnO for Transparent Thin Film Transistor Applications
116Electrical Properties of Al2O3 Films Grown by the Electron Cyclotron Resonance Plasma-Enhanced Atomic Layer Deposition (ECR-PEALD) and Thermal ALD Methods
117Characteristics of Atomic-Layer-Deposited HfO2 Films by Using a Remote Plasma on Pre-Deposited Hf Metal Layer
118Oxygen migration in TiO2-based higher-k gate stacks
119Increment of the Dielectric Constant of Ta2O5 Thin Films by Retarding Interface Oxide Growth on Si Substrates
120Effects of an Al2O3 capping layer on La2O3 deposited by remote plasma atomic layer deposition
121Improvement of interfacial and electrical properties of Al2O3/n-Ga0.47In0.53As for III-V impact ionization MOSFETs
122ZrO2 on GaN metal oxide semiconductor capacitors via plasma assisted atomic layer deposition
123Electrical properties of Ga2O3-based dielectric thin films prepared by plasma enhanced atomic layer deposition (PEALD)
124AlGaN/GaN MIS-HEMTs With High Quality ALD-Al2O3 Gate Dielectric Using Water and Remote Oxygen Plasma As Oxidants
125Plasma-enhanced atomic layer deposition of titanium oxynitrides films: A comparative spectroscopic and electrical study
126Low-temperature plasma-enhanced atomic layer deposition of HfO2/Al2O3 nanolaminate structure on Si
127Influence of Atomic Layer Deposition Temperatures on TiO2/n-Si MOS Capacitor
128In situ surface cleaning on a Ge substrate using TMA and MgCp2 for HfO2-based gate oxides
129Plasma enhanced atomic layer deposition of Al2O3 gate dielectric thin films on AlGaN/GaN substrates: The role of surface predeposition treatments
130Characteristics of Al2O3 Thin Films Deposited Using Dimethylaluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
131AlGaN/GaN MIS-HEMT gate structure improvement using Al2O3 deposited by plasma-enhanced ALD
132Investigation of field-effect passivation and interface state parameters at the Al2O3/Si interface
133Atomic Layer Densification of AlN Passivation Layer on Epitaxial Ge for Enhancement of Reliability and Electrical Performance of High-K Gate Stacks
134Passivation of InGaAs interface states by thin AlN interface layers for metal-insulator-semiconductor applications
135Characteristics of high-k dielectric ECR-ALD lanthanum hafnium oxide (LHO) films
136Plasma enhanced atomic layer deposition of HfO2 and ZrO2 high-k thin films
137Influence of stoichiometry on the performance of MIM capacitors from plasma-assisted ALD SrxTiyOz films