Atomic Layer Densification of AlN Passivation Layer on Epitaxial Ge for Enhancement of Reliability and Electrical Performance of High-K Gate Stacks
Type:
Journal
Info:
ACS Appl. Electron. Mater. 2020, 2, 4, 891-897
Date:
2020-03-24
Author Information
Name | Institution |
---|---|
Chin-I Wang | National Taiwan University |
Teng-Jan Chang | National Taiwan University |
Yu-Tung Yin | National Taiwan University |
Yu-Sen Jiang | National Taiwan University |
Jing-Jong Shyue | Academia Sinica |
Miin-Jang Chen | National Taiwan University |
Films
Plasma AlN
Plasma AlN
Hardware used: Veeco - Ultratech - Cambridge NanoTech Fiji
CAS#: 7727-37-9
CAS#: 7440-37-1
CAS#: 7440-59-7
Plasma TiN
Thermal HfO2
Film/Plasma Properties
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Interface Trap Density
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Density
Analysis: XRR, X-Ray Reflectivity
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Images
Analysis: TEM, Transmission Electron Microscope
Substrates
Ge |
Notes
1480 |