Characteristics of Al2O3 Thin Films Deposited Using Dimethylaluminum Isopropoxide and Trimethylaluminum Precursors by the Plasma-Enhanced Atomic-Layer Deposition Method
Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 48, No. 1, January 2006, pp. 131~136
Date:
2006-01-01
Author Information
Name | Institution |
---|---|
Jaehyoung Koo | Hanyang University |
Seokhoon Kim | Hanyang University |
Sangmin Jeon | Hanyang University |
Hyeongtag Jeon | Hanyang University |
Yangdo Kim | Pusan National University |
Youngdo Won | Hanyang University |
Films
Plasma Al2O3
Plasma Al2O3
Film/Plasma Properties
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Thickness
Analysis: Ellipsometry
Characteristic: Bonding States
Analysis: XPS, X-ray Photoelectron Spectroscopy
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Substrates
Silicon |
Notes
Rapid thermal anneal |
Forming gas anneal |
Substrates pirahna and HF cleaned |
4 |