Characteristics of Atomic-Layer-Deposited HfO2 Films by Using a Remote Plasma on Pre-Deposited Hf Metal Layer
Type:
Journal
Info:
Journal of the Korean Physical Society, Vol. 52, No. 4, pp. 1114-1119
Date:
2008-01-02
Author Information
Name | Institution |
---|---|
Hyungseok Hong | Hanyang University |
Seokhoon Kim | Hanyang University |
Sanghyun Woo | Hanyang University |
Hyungchul Kim | Hanyang University |
Honggyu Kim | Hanyang University |
Wooho Jeong | Hanyang University |
Sunyeol Jeon | Hanyang University |
Seokhwan Bang | Hanyang University |
Seungjun Lee | Hanyang University |
Hyeongtag Jeon | Hanyang University |
Films
Film/Plasma Properties
Characteristic: Thickness
Analysis: TEM, Transmission Electron Microscope
Characteristic: Interlayer
Analysis: TEM, Transmission Electron Microscope
Characteristic: Crystallinity, Crystal Structure, Grain Size, Atomic Structure
Analysis: TEM, Transmission Electron Microscope
Characteristic: Compositional Depth Profiling
Analysis: AES, Auger Electron Spectroscopy
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Flat Band Voltage
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: EOT, Equivalent Oxide Thickness
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Hysteresis
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Fixed Charge
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Substrates
Hf |
Notes
1198 |