
High aspect ratio iridescent three-dimensional metal-insulator-metal capacitors using atomic layer deposition
Type:
Journal
Info:
J. Vac. Sci. Technol. A 33(1), Jan/Feb 2015
Date:
2014-07-15
Author Information
| Name | Institution |
|---|---|
| Michael Burke | Tyndall National Institute, University College Cork |
| Alan Blake | Tyndall National Institute, University College Cork |
| Vladamir Djara | Tyndall National Institute, University College Cork |
| Dan O'Connell | Tyndall National Institute, University College Cork |
| Ian M. Povey | Tyndall National Institute, University College Cork |
| Karim Cherkaoui | Tyndall National Institute, University College Cork |
| Scott Monaghan | Tyndall National Institute, University College Cork |
| Jim Scully | Tyndall National Institute, University College Cork |
| Richard Murphy | Tyndall National Institute, University College Cork |
| Paul K. Hurley | Tyndall National Institute, University College Cork |
| Martin E. Pemble | Tyndall National Institute, University College Cork |
| Aidan J. Quinn | Tyndall National Institute, University College Cork |
Films
Thermal Al2O3
Plasma TiN
Film/Plasma Properties
Characteristic: Capacitance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: ESR, Equivalent Series Resistance
Analysis: C-V, Capacitance-Voltage Measurements
Characteristic: Quality Factor
Analysis: Q-V, Quality-Voltage Measurements
Characteristic: Leakage Current
Analysis: I-V, Current-Voltage Measurements
Characteristic: Thickness
Analysis: SEM, Scanning Electron Microscopy
Substrates
| Si(100) |
Notes
| 30:1 trenches. TiN thinner at bottom. |
| TiN etched with Cl2 which is highly selective to Al2O3. |
| Via to bottom electrode etched with non-selective BCl3 process. |
| 107 |
